Ph.D. candidate · University of Illinois Urbana-Champaign · Energy Transport Research Laboratory
Making hot silicon cold, and explaining exactly how.
I design, build and model the cooling that keeps 10 kW-class GPUs, megawatt racks and EV batteries inside their thermal limits: manifold cold plates, printed copper, boiling immersion, and the first chip-to-ambient transient model of a liquid-cooled AI rack.
↑ the field above is a live heat-diffusion solve. Move your cursor to add heat; the coolant sweeps it away.
208
W/cm²
heat flux removed, GaN cooler, measured
1.6 × 10⁶
COP
cooling coefficient of performance
126
chips
in one transient rack model, chip to ambient
10 kW
target
per package, the next design problem
Research
Four problems, one thread: move heat out of the places it is hardest to reach.
Manifold cold plates for 10 kW-class AI GPU packages
From a validated 208 W/cm² GaN cooler to a design methodology for 10 kW on an 80 mm package.
Conjugate CFD · PyFluent automation · Reduced-order modeling · Gaussian processes
Dynamic system modeling of liquid-cooled AI data centers
The first chip-to-ambient transient model of a direct-to-chip liquid-cooled AI rack, run under real workloads and real weather.
Simscape Fluids · Control design · Stiff DAE solvers · System identification
Additively manufactured cold plates for GPUs
Monolithic copper and aluminium cold plates with geometry only metal 3D printing can make.
Design for additive manufacturing · Laser powder-bed fusion · Conjugate CFD · GPU-level testing
Li-ion battery thermal management
Boiling immersion and internal channels that keep fast-charging cells near-isothermal.
Two-phase immersion · Rig design and commissioning · Battery cycling · Electro-thermal modeling
Selected publications
Peer-reviewed, measured, reproducible.
- 2026High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation
International Journal of Heat and Mass Transfer 268, 128924
A hotspot-aware, Pareto-optimized copper manifold microchannel cooler cuts pressure drop by 70–98 % and thermal resistance by 19–26 % versus the baseline, removes 208 W/cm² from a six-device GaN board, and reaches a cooling COP of 1.6 × 10⁶, with CFD within 3 % of experiment.
- 2026Metal additive manufacturing enables monolithic copper cold plate development with sinusoidal microchannels for direct-to-chip cooling
Advances in Heat Transfer, special issue on Data Center and Electronics Cooling
First-author chapter with 3D Systems on printing a copper cold plate as one part, with wavy microchannels no machine tool can cut, and testing it on a GPU-class heat load. In revision after reviewer round one.
- 2026Immersion-cooled 1U power supply unit for fanless, warm-liquid-cooled data centers
Applied Thermal Engineering 303, 132309
Removing the last fans from a liquid-cooled rack: a 1U power supply immersed in dielectric fluid and cooled by the warm facility water loop.
Now
Graduating by 2028. Looking for the hardest thermal problems in industry.
Presenting at ASME InterPACK 2026 in San Diego (paper 188693, advanced liquid cooling for high-power electronics).
Writing up the rack-scale dynamic system model and finishing the ML-assisted manifold cold plate design campaign.
Interested in data-center thermal management, semiconductor packaging thermal, and EV thermal systems.
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